EDExpress for Windows 2021–2022 Packaging Technical Reference

Author
Federal Student Aid
Subject
EDExpress for Windows 2021–2022 Packaging Technical Reference

We are pleased to announce the availability of the 2021–2022 EDExpress for Windows Packaging Technical Reference on the Software and Other Tools page of the Information for Financial Aid Professionals (IFAP) website (https://ifap.ed.gov/software-and-other-tools). The reference is available in the EDExpress section.

The Packaging Technical Reference provides instructions and record layouts for schools and other organizations that need to integrate their software or systems with the EDExpress 2021–2022 Packaging module (available late September 2020). Record layouts are included for all imports from external systems, such as Packaging Import External Add, Packaging Import External Change, and Packaging Import Add Funds. Packaging module setup guidance and setup worksheets are also provided.

If you have any questions regarding this message, contact CPS/SAIG Technical Support at 1-800-330-5947 or by email at CPSSAIG@ed.gov.